• ASTM F584-87(2005)

ASTM F584-87(2005)

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

ASTM International, 05/01/2005

Publisher: ASTM

File Format: PDF

$29.00$58.00


Published:01/05/2005

Pages:7

File Size:1 file , 390 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

More ASTM standard pdf

ASTM B616-96(2012)

ASTM B616-96(2012)

Standard Specification for Refined Rhodium

$26.00 $52.00

ASTM D7668-12a

ASTM D7668-12a

Standard Test Method for Determination of Derived Cetane Number (DCN) of Diesel Fuel Oils -- Ignition Delay and Combustion Delay Using a Constant Volume Combustion Chamber Method

$33.00 $67.00

ASTM E2261/E2261M-12

ASTM E2261/E2261M-12

Standard Practice for Examination of Welds Using the Alternating Current Field Measurement Technique

$32.00 $65.00

ASTM D7324-07

ASTM D7324-07

Standard Practice for Handling, Transportation, and Storage of IG-55 Ar N2

$25.00 $50.00