BS 3934-5:1992

Mechanical standardization of semiconductor devices-Recommendations for tape automated bonding (TAB) of integrated circuits

BSI Group, 04/01/1992

Publisher: BS

File Format: PDF

$125.00$251.46

Description

Published:01/04/1992

Pages:16

File Size:1 file

Note:This product is unavailable in Ukraine, Russia, Belarus

Recommendations cover the requirements resulting from the sale of tape with or without bonded integrated circuits by a manufacturer to a user. They are not intended to govern strictly internal usage such as the use of TAB as one step in the manufacture of DIL packages or 'chip carriers'.

All current amendments available at time of purchase are included with the purchase of this document.

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