BS 3934-5:1997

Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

BSI Group, 09/15/1997

Publisher: BS

File Format: PDF

$147.00$294.64

Description

Published:15/09/1997

Pages:38

File Size:1 file , 940 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

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