BS PD ES 59008-3:1999

Data requirements for semiconductor die-Mechanical, material and connectivity requirements

BSI Group, 12/15/1999

Publisher: BS

File Format: PDF

$76.00$152.40

Description

Published:15/12/1999

Pages:14

File Size:1 file , 390 KB

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Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1

Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*