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  • BS PD IEC TR 61760-3-1:2022

BS PD IEC TR 61760-3-1:2022

Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

BSI Group, 10/31/2022

Publisher: BS

File Format: PDF

$125.00$251.46


Published:31/10/2022

Pages:30

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus



All current amendments available at time of purchase are included with the purchase of this document.

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