BS PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

BSI Group, 01/11/2022

Publisher: BS

File Format: PDF

$125.00$251.46

Description

Published:11/01/2022

Pages:24

File Size:1 file , 2.4 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.

More BS standard pdf

BS 7461:1991

Specification for electrically operated automatic gas shut-off valves fitted with throughput adjusters, proof of closure switches, closed position indicator switches or gas flow control

$76.00 $152.40

BS 6043-4.7:1991

Methods of sampling and test for carbonaceous materials used in aluminium manufacture. Cold ramming pastes-Preparation of baked rammed test pieces and determination of baked apparent density, change in volume and loss in mass

$76.00 $152.40

BS 3521-1:1991

Terms relating to ophthalmic lenses and spectacle frames-Glossary of terms relating to ophthalmic lenses

$166.00 $332.74

BS 1212-4:1991

Float operated valves-Specification for compact type float operated valves for WC flushing cisterns (including floats)

$90.00 $180.34