• Your shopping cart is empty!

  • IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

International Electrotechnical Commission, 07/28/2010

Publisher: IEC

File Format: PDF

$119.00$238.41


Published:28/07/2010

Pages:1

File Size:1 file , 81 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

More IEC standard pdf

IEC 61558-2-9 Ed. 1.0 b:2002

IEC 61558-2-9 Ed. 1.0 b:2002

Safety of power transformers, power supply units and similar products - Part 2-9: Particular requirements for transformers for class III handlamps for tungsten filament lamps

$33.00 $66.00

IEC 61000-4-28 Ed. 1.1 b:2002

IEC 61000-4-28 Ed. 1.1 b:2002

Electromagnetic compatibility (EMC) - Part 4-28: Testing and measurement techniques - Variation of power frequency, immunity test CONSOLIDATED EDITION

$33.00 $66.00

IEC 60774-4 Ed. 1.0 en:2002

IEC 60774-4 Ed. 1.0 en:2002

Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS - Part 4: S-VHS video cassette system - ET mode

$25.00 $51.00

IEC 61000-4-14 Ed. 1.1 b:2002

IEC 61000-4-14 Ed. 1.1 b:2002

Electromagnetic compatibility (EMC) - Part 4-14: Testing and measurement techniques - Voltage fluctuation immunity test CONSOLIDATED EDITION

$46.00 $92.00