• Your shopping cart is empty!

PDF Preview

IEC 60191-6-2 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

International Electrotechnical Commission, 12/11/2001

Publisher: IEC

File Format: PDF

$31.00$62.00


Published:11/12/2001

Pages:10

File Size:1 file , 260 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.

More IEC standard pdf

IEC 60264-3-2 Ed. 2.0 b:1999

IEC 60264-3-2 Ed. 2.0 b:1999

Packaging of winding wires - Part 3-2: Taper barrelled delivery spools - Specification for returnable spools made from thermoplastic materials

$12.00 $25.00

IEC 61964 Ed. 1.0 b:1999

IEC 61964 Ed. 1.0 b:1999

Integrated circuits - Memory devices pin configurations

$72.00 $145.00

IEC 60331-21 Ed. 1.0 b:1999

IEC 60331-21 Ed. 1.0 b:1999

Tests for electric cables under fire conditions - Circuit integrity - Part 21: Procedures and requirements - Cables of rated voltage up to and including 0,6/1,0 kV

$25.00 $51.00

IEC 60317-0-4 Amd.1 Ed. 2.0 b:1999

IEC 60317-0-4 Amd.1 Ed. 2.0 b:1999

Amendment 1 - Specifications for particular types of winding wires - Part 0:General requirements - Section 4: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire

$7.00 $14.00