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IEC 60191-6-3 Ed. 1.0 en:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

International Electrotechnical Commission, 09/29/2000

Publisher: IEC

File Format: PDF

$52.00$104.00


Published:29/09/2000

Pages:17

File Size:1 file , 180 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.

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