IEC 60749-3 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

International Electrotechnical Commission, 04/09/2002

Publisher: IEC

File Format: PDF

$6.00$12.00


Published:09/04/2002

Pages:7

File Size:1 file , 360 KB

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Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

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