IEC 61188-1-2 Ed. 1.0 b:1998

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

International Electrotechnical Commission, 04/29/1998

Publisher: IEC

File Format: PDF

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Description

Published:29/04/1998

Pages:83

File Size:1 file , 470 KB

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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

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