IEC 61188-5-1 Ed. 1.0 b:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

International Electrotechnical Commission, 07/12/2002

Publisher: IEC

File Format: PDF

$196.00$392.00

Description

Published:12/07/2002

Pages:141

File Size:1 file , 6.2 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

More IEC standard pdf

IEC 61076-3-104 Ed. 3.0 en:2017

Connectors for electrical and electronic equipment - Product requirements - Part 3-104: Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 2 000 MHz

$208.00 $417.00

IEC 62087-5 Ed. 1.0 b:2015

Audio, video, and related equipment - Determination of power consumption - Part 5: Set-top-boxes (STB)

$72.00 $145.00

IEC 62657-1 Ed. 1.0 b:2017

Industrial communication networks - Wireless communication networks - Part 1: Wireless communication requirements and spectrum considerations

$208.00 $417.00

IEC 62481-1 Ed. 2.0 en:2013

Digital living network alliance (DLNA) home networked device interoperability guidelines - Part 1: Archtecture and protocols

$205.00 $410.00