IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

International Electrotechnical Commission, 05/02/2019

Publisher: IEC

File Format: PDF

$164.00$329.00

Description

Published:02/05/2019

Pages:81

File Size:1 file , 4.8 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

More IEC standard pdf

IEC 60335-2-40 Ed. 7.0 b:2022

Household and similar electrical appliances - Safety - Part 2-40: Particular requirements for electrical heat pumps, air-conditioners and dehumidifiers

$256.00 $512.00

IEC 60749-39 Ed. 2.0 b:2021

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

$47.00 $95.00

IEC 61051-2 Ed. 2.0 b:2021

Varistors for use in electronic equipment - Part 2: Sectional specification for surge suppression varistors

$95.00 $190.00

IEC 63294 Ed. 1.0 b:2021

Test methods for electric cables with rated voltages up to and including 450/750 V

$117.00 $234.00