IEC 61189-2-803 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

International Electrotechnical Commission, 07/01/2023

Publisher: IEC

File Format: PDF

$12.00$25.00

Description

Published:01/07/2023

Pages:20

File Size:1 file , 710 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).

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