• Your shopping cart is empty!

  • IEC 61189-5-4 Ed. 1.0 b:2015

IEC 61189-5-4 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

International Electrotechnical Commission, 01/08/2015

Publisher: IEC

File Format: PDF

$95.00$190.00


Published:08/01/2015

Pages:45

File Size:1 file , 500 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.

More IEC standard pdf

IEC 60335-2-32 Ed. 4.2 b:2013

IEC 60335-2-32 Ed. 4.2 b:2013

Household and similar electrical appliances - Safety - Part 2-32:Particular requirements for massage appliances CONSOLIDATED EDITION

$47.00 $94.00

IEC 60728-11 Ed. 4.0 b:2016

IEC 60728-11 Ed. 4.0 b:2016

Cable networks for television signals, sound signals and interactive services - Part 11: Safety

$208.00 $417.00

IEC 60743 Ed. 2.1 b:2008

IEC 60743 Ed. 2.1 b:2008

Live working - Terminology for tools, equipment and devices CONSOLIDATED EDITION

$188.00 $376.00

IEC 60335-1 Ed. 5.1 b:2013

IEC 60335-1 Ed. 5.1 b:2013

Household and similar electrical appliances - Safety - Part 1:General requirements CONSOLIDATED EDITION

$381.00 $762.00