IEC 61190-1-2 Ed. 2.0 b:2007

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

International Electrotechnical Commission, 04/26/2007

Publisher: IEC

File Format: PDF

$60.00$121.00


Published:26/04/2007

Pages:37

File Size:1 file , 1.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

More IEC standard pdf

IEC 60335-2-5 Ed. 5.0 b:2002

IEC 60335-2-5 Ed. 5.0 b:2002

Household and similar electrical appliances - Safety - Part 2-5: Particular requirements for dishwashers

$58.00 $116.00

IEC 62197-1 Ed. 1.0 b:2006

IEC 62197-1 Ed. 1.0 b:2006

Connectors for electronic equipment - Quality assessment requirements - Part 1: Generic specification

$117.00 $234.00

IEC 60947-7-3 Ed. 1.0 b:2002

IEC 60947-7-3 Ed. 1.0 b:2002

Low-voltage switchgear and controlgear - Part 7-3: Ancillary equipment - Safety requirements for fuse terminal blocks

$79.00 $158.00

IEC 60335-2-72 Ed. 2.0 b:2002

IEC 60335-2-72 Ed. 2.0 b:2002

Household and similar electrical appliances - Safety - Part 2-72: Particular requirements for automatic machines for floor treatment for commercial and industrial use

$70.00 $141.00