IEC 61249-8-8 Ed. 1.0 b:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

International Electrotechnical Commission, 06/24/1997

Publisher: IEC

File Format: PDF

$25.00$51.00

Description

Published:24/06/1997

Pages:19

File Size:1 file , 120 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

More IEC standard pdf

IEC 60317-0-3 Ed. 3.2 b:2019

Specifications for particular types of winding wires - Part 0-3: General requirements - Enamelled round aluminium wire CONSOLIDATED EDITION

$158.00 $316.00

IEC 60747-14-10 Ed. 1.0 b:2019

Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors

$139.00 $278.00

IEC 61300-2-54 Ed. 1.0 en:2019

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-54: Tests - Corrosive atmosphere (mixed gas)

$25.00 $51.00

IEC 62645 Ed. 2.0 b:2019

Nuclear power plants - Instrumentation, control and electrical power systems - Cybersecurity requirements

$183.00 $367.00