• IEC 62047-13 Ed. 1.0 b:2012

IEC 62047-13 Ed. 1.0 b:2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

International Electrotechnical Commission, 02/28/2012

Publisher: IEC

File Format: PDF

$47.00$95.00


Published:28/02/2012

Pages:30

File Size:1 file , 510 KB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

More IEC standard pdf

IEC 60317-8 Ed. 4.0 b:2010

IEC 60317-8 Ed. 4.0 b:2010

Specifications for particular types of winding wires - Part 8: Polyesterimide enamelled round copper wire, class 180

$25.00 $51.00

IEC 61557-9 Ed. 3.0 b:2014

IEC 61557-9 Ed. 3.0 b:2014

Electrical safety in low voltage distribution systems up to 1 000 V a.c. and 1 500 V d.c. - Equipment for testing, measuring or monitoring of protective measures - Part 9: Equipment for insulation fault location in IT systems

$117.00 $234.00

IEC 60958-SER Ed. 1.0 en:2016

IEC 60958-SER Ed. 1.0 en:2016

Digital audio interface - ALL PARTS

$508.00 $1,017.00

IEC 62776 Ed. 1.0 b:2014

IEC 62776 Ed. 1.0 b:2014

Double-capped LED lamps designed to retrofit linear fluorescent lamps - Safety specifications

$117.00 $234.00