IEC 62769-6 Ed. 2.0 b:2021

Field Device Integration (FDI) - Part 6: FDI Technology Mapping

International Electrotechnical Commission, 02/05/2021

Publisher: IEC

File Format: PDF

$117.00$234.00

Description

Published:05/02/2021

Pages:52

File Size:1 file , 1.6 MB

Note:This product is unavailable in Ukraine, Russia, Belarus

IEC 62769-6:2021 specifies the technology mapping for the concepts described in the Field Device Integration (FDI) standard. The technology mapping focuses on implementation regarding the components FDI Client and User Interface Plug-in (UIP) that are specific only to the workstation platform as defined in IEC 62769-4:2015, Annex E.

More IEC standard pdf

IEC 60096-4-1 Ed. 1.0 b:1990

Radio-frequency cables. Part 4: Specification for superscreened cables - Section One: General requirements and test methods

$43.00 $87.00

IEC 60534-2-5 Ed. 1.0 b:2003

Industrial-process control valves - Part 2-5: Flow capacity - Sizing equations for fluid flow through multistage control valves with interstage recovery

$77.00 $154.00

IEC 60264-4-2 Amd.1 Ed. 1.0 b:2003

Amendment 1 - Packaging of winding wires - Part 4-2: Methods of test - Containers made from thermoplastic material for taper barrelled delivery spools

$6.00 $13.00

IEC 62148-11 Ed. 1.0 b:2003

Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator-integrated laser diode transmitters

$25.00 $51.00