Your shopping cart is empty!
PDF Preview
International Electrotechnical Commission, 08/01/2021
Publisher: IEC
File Format: PDF
$164.00$329.00
Published:01/08/2021
Pages:90
File Size:1 file , 2.7 MB
Note:This product is unavailable in Ukraine, Russia, Belarus
This part of IEC 63287 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications.
NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified.
NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
Specification for non-impregnated, densified laminated wood for electrical purposes - Part 2: Methods of test CONSOLIDATED EDITION
$69.00 $139.00
Radiotherapy equipment - Coordinates, movements and scales CONSOLIDATED EDITION CONSOLIDATED EDITION
$123.00 $247.00
Amendment 1 - Specification for plastic films for electrical purposes. Part 2: Methods of test
$15.00 $31.00
Printed boards - Part 1: Generic specification
$183.00 $367.00