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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$59.00$118.00
Published:01/10/2022
Pages:36
File Size:1 file , 3.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. This standard is used to support product typically requiring materials meeting the requirements of IPC-4103 and fabricated to the requirements of IPC-6018.
Sectional Design Standard for Flexible Printed Boards
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Surface Mount Placement Equipment Characterization
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Specification for Base Materials for High Speed/High Frequency Applications
Stencil Design Guidelines
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