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Association Connecting Electronics Industries, 11/01/2003
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/11/2003
Pages:22
File Size:1 file , 240 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Sectional Design Standard for Rigid Organic Printed Boards
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User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
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