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Association Connecting Electronics Industries, 04/01/2022
Publisher: IPC
File Format: PDF
$59.00$119.00
Published:01/04/2022
Pages:24
File Size:1 file , 990 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
$32.00 $65.00
Requirements for Soldered Electrical and Electronic Assemblies
$80.00 $160.00
Design and End Product Requirements for Discrete Wiring Boards
$71.00 $142.00
Technical Report: Wetting Balance Standard Weight Comparison Test
$43.00 $86.00
