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IPC 7092

Design and Assembly Process Implementation for Embedded Components

Association Connecting Electronics Industries, 02/01/2015

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/02/2015

Pages:147

File Size:1 file , 8.8 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

IPC 7092 describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn characteristics that influence the successful implementation of a robust embedded component process.

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