IPC 7525

This new document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus document. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed; this includes overprint, two-print and step stencil designs. A sample order form and a user inspection checklist are also included.