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Association Connecting Electronics Industries, 12/01/2016
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/12/2016
Pages:44
File Size:1 file , 2.7 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.
Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
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Requirements and Acceptance for Cable and Wire Harness Assemblies
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Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
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