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Association Connecting Electronics Industries, 10/01/2006
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/10/2006
Pages:24
File Size:1 file , 220 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Sectional Design Standard for High Density Interconnect (HDI) Boards
$67.00 $135.00
Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
$50.00 $101.00
Assembly Process Component Simulations, Guidelines and Classifications Package
$112.00 $225.00
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations