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Association Connecting Electronics Industries, 04/01/1988
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/04/1988
Pages:11
File Size:1 file , 210 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
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Selection and Application of Board Level Underfill Materials
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Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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