IPC J-STD-013

Implementation of Ball Grid Array and Other High Density Technology

Association Connecting Electronics Industries, 08/01/1996

Publisher: IPC

File Format: PDF

$71.00$142.00

Description

Published:01/08/1996

Pages:123

File Size:1 file

Note:This product is unavailable in Russia, Ukraine, Belarus

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.

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