• Your shopping cart is empty!

  • IPC SMC-TR-001

IPC SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

Association Connecting Electronics Industries, 01/01/1989

Publisher: IPC

File Format: PDF

$44.00$88.00


Published:01/01/1989

Pages:54

File Size:1 file , 1.4 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

More IPC standard pdf

IPC J-STD-003C-WAM1&2

IPC J-STD-003C-WAM1&2

Solderability Tests for Printed Boards with Amendment 1&2

$91.00 $182.00

IPC 4552A

IPC 4552A

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

$91.00 $182.00

IPC 6013D

IPC 6013D

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

$91.00 $182.00

IPC 1755 WAM1&2

IPC 1755 WAM1&2

Conflict Minerals Data Exchange Standard

$76.00 $153.00