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Association Connecting Electronics Industries, 01/01/1993
Publisher: IPC
File Format: PDF
$61.00$123.00
Published:01/01/1993
Pages:51
Note:This product is unavailable in Russia, Ukraine, Belarus
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
$50.00 $101.00
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
$58.00 $117.00
Stencil Design Guidelines
Spherical Bend Test Method for Characterization of Board Level Interconnects
$86.00 $173.00
