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Association Connecting Electronics Industries, 03/01/1979
Publisher: IPC
File Format: PDF
$43.00$86.00
Published:01/03/1979
Pages:40
Note:This product is unavailable in Russia, Ukraine, Belarus
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
$51.00 $103.00
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
