IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Association Connecting Electronics Industries, 07/01/2001

Publisher: IPC

File Format: PDF

$71.00$142.00

Description

Published:01/07/2001

Pages:56

File Size:1 file , 760 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.

More IPC standard pdf

IPC 9191

General Guidelines for Implementation of Statistical Process Control (SPC)

$71.00 $142.00

IPC 6012A-AM

Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

$31.00 $63.00

IPC BULK-99-CD

Bulk Feeding Summit Meeting Proceedings on CD Rom - September 1999

$27.00 $54.00

IPC 6202

Performance guide Manual for single- and double-sided flexible printed wiring boards

$67.00 $134.00