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JEDEC Solid State Technology Association, 09/01/2016
Publisher: JEDEC
File Format: PDF
$104.00$208.00
Published:01/09/2016
Pages:174
File Size:1 file , 4.3 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOND WIRE MODELING STANDARD
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QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
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