JEDEC JESD217A

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

JEDEC Solid State Technology Association, 10/01/2022

Publisher: JEDEC

File Format: PDF

$100.00$200.03

Description

Published:01/10/2022

Pages:48

File Size:1 file , 2.4 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.