JEDEC JESD22-B116B

WIRE BOND SHEAR TEST

JEDEC Solid State Technology Association, 04/01/2017

Publisher: JEDEC

File Format: PDF

$37.00$74.00

Description

Published:01/04/2017

Pages:32

File Size:1 file , 1.8 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.