JEDEC JESD22-B118

SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

JEDEC Solid State Technology Association, 03/01/2011

Publisher: JEDEC

File Format: PDF

$29.00$59.00

Description

Published:01/03/2011

Pages:18

File Size:1 file , 770 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.

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