• Your shopping cart is empty!

  • JEDEC JESD51-32

JEDEC JESD51-32

THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES

JEDEC Solid State Technology Association, 12/01/2010

Publisher: JEDEC

File Format: PDF

$25.00$51.00


Published:01/12/2010

Pages:10

File Size:1 file , 38 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described in this standard are also applicable to single chip packages needing more than 36 electrical connections for the test.

More JEDEC standard pdf

JEDEC JEP150

JEDEC JEP150

STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS

$30.00 $60.00

JEDEC JEP131A

JEDEC JEP131A

PROCESS FAILURE MODE AND EFFECTS ANALYSIS (FMEA)

$36.00 $72.00

JEDEC JESD8-17

JEDEC JESD8-17

DRIVER SPECIFICATIONS FOR 1.8 V POWER SUPPLY POINT-TO-POINT DRIVERS

$25.00 $51.00

JEDEC JESD22-B104C (R2009)

JEDEC JESD22-B104C (R2009)

MECHANICAL SHOCK

$26.00 $53.00