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Association Connecting Electronics Industries, 08/01/2021
Publisher: IPC
File Format: PDF
$75.00$150.00
Published:01/08/2021
Pages:60
File Size:1 file , 1.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
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