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Association Connecting Electronics Industries, 07/01/2015
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/07/2015
Pages:168
File Size:1 file , 860 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
$91.00 $182.00
Implementation of Flip Chip and Chip Scale Technology
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
$32.00 $65.00
Requirements for Soldered Electrical and Electronic Assemblies
$80.00 $160.00
Design and End Product Requirements for Discrete Wiring Boards
$71.00 $142.00