IPC 4104

Specifications for High Density Interconnect (HDI) and Microvia Materials

Association Connecting Electronics Industries, 05/01/1999

Publisher: IPC

File Format: PDF

$71.00$142.00

Description

Published:01/05/1999

Pages:100

File Size:1 file , 440 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.