IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline

Association Connecting Electronics Industries, 11/01/2007

Publisher: IPC

File Format: PDF

$50.00$101.00

Description

Published:01/11/2007

Pages:19

File Size:1 file , 270 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

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