IPC 9301

Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

Association Connecting Electronics Industries, 12/01/2018

Publisher: IPC

File Format: PDF

$86.00$173.00


Published:01/12/2018

Pages:92

File Size:1 file , 7.4 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

More IPC standard pdf

IPC 2228

IPC 2228

Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards

$59.00 $118.00

IPC 9202A

IPC 9202A

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly

$50.00 $101.00

IPC J-STD-003D:2022

IPC J-STD-003D:2022

Solderability Tests for Printed Boards

$90.00 $181.00

IPC 2292A

IPC 2292A

Design Standard for Printed Electronics on Flexible Substrates

$90.00 $181.00