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Association Connecting Electronics Industries, 12/01/2022
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/12/2022
Pages:26
File Size:1 file , 2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic devices. This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility.
In-Process DPMO and Estimated Yield for PCAs
$50.00 $101.00
Specification for Immersion Tin Plating for Printed Circuit Boards
$91.00 $182.00
Design Guide for Protection of Printed Board Via Structures
Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)
$86.00 $173.00
