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Association Connecting Electronics Industries, 09/01/1984
Publisher: IPC
File Format: PDF
$56.00$113.00
Published:01/09/1984
Pages:62
Note:This product is unavailable in Russia, Ukraine, Belarus
Leading Edge Manufacturing Technology Report
$56.00 $113.00
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
$51.00 $103.00
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
