Your shopping cart is empty!
PDF Preview
Association Connecting Electronics Industries, 10/01/2021
Publisher: IPC
File Format: PDF
$29.00$58.00
Published:01/10/2021
Pages:20
File Size:1 file , 1.5 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document introduces design concepts, attributes, and recommendations for the control and mitigation of performance and reliability risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic (E/E) assemblies, including optical and metallic cable and wiring harness assemblies, and elements thereof.
Electronic Design Data Description for Printed Boards in Digital Form
$71.00 $142.00
Results of Copper Foil Rupture Strength Test Round Robin Study
$43.00 $86.00
Leading Edge Manufacturing Technology Report
$56.00 $113.00
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
$48.00 $97.00