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JEDEC Solid State Technology Association, 05/01/2023
Publisher: JEDEC
File Format: PDF
$127.00$254.29
Published:01/05/2023
Pages:36
File Size:1 file , 440 KB
Note:This product is unavailable in Russia, Belarus
This publication is intended only as a guideline to test facilities in their efforts to establish and maintain consistent PIND testing. Imposition of these suggestions, or any part thereof, is within the province of each test facility as to its respective needs.
FIELD-INDUCED CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND THRESHOLDS OF MICROELECTRONIC COMPONENTS
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3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
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TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR DISCRETE SEMICONDUCTOR AND OPTOELECTRONIC DEVICES
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