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JEDEC Solid State Technology Association, 01/01/2023
Publisher: JEDEC
File Format: PDF
$114.00$229.40
Published:01/01/2023
Pages:16
File Size:1 file , 340 KB
Note:This product is unavailable in Russia, Belarus
Terminology update. This document should be used in conjunction with the parent document, and is intended to function as an overview to support the effective use of Compact Thermal Model (CTM) methodologies as specified in the companion methods documents.
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
$27.00 $54.00
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
$30.00 $60.00
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
$38.00 $76.00
EMBEDDED MULTIMEDIACARD (e*MMC)MECHANICAL STANDARD
