JEDEC JESD22-B106D

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

JEDEC Solid State Technology Association, 04/01/2008

Publisher: JEDEC

File Format: PDF

$26.00$53.00

Description

Published:01/04/2008

Pages:12

File Size:1 file , 70 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.

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