JEDEC JESD22-B117A

SOLDER BALL SHEAR

JEDEC Solid State Technology Association, 10/01/2006

Publisher: JEDEC

File Format: PDF

$28.00$56.00

Description

Published:01/10/2006

Pages:15

File Size:1 file , 230 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

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